| abstract |
A semiconductor device includes a capacitor provided above a substrate including electrodes and a ferroelectric film provided therebetween, a pad electrode electrically connected to one of the electrodes of the capacitor, the pad electrode being formed above the substrate, the pad electrode having a recess on a surface of the substrate, a protective film covering a part of the pad electrode other than the recess on the exposed surface, and a hydrogen absorbing film on the protective film and the recess of the pad electrode. |