| abstract |
The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1 , has: a circuit element 5 a formed on a substrate 2 ; an electrode layer 5 b connected to the circuit element 5 a ; passivation layers 6 and 8 that cover the electrode layer 5 b ; and terminal electrodes 9 a and 9 b connected to the electrode layer 5 b via via-conductors Va and Vb formed through the passivation layers 6 and 8 , the terminal electrodes 9 a and 9 b being formed to cover the side wall of the passivation layers 6 and 8 . Since the pad electrodes 9 a and 9 b are formed so as to cover the passivation layers 6 and 8 across their uppermost surfaces and side walls, the area of contact between the pad electrodes 9 a and 9 b and the solder for solder-mounting increases, and the capacitor 1 can consequently exhibit an improved adhesion strength. |