Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7b4f43175276bfe6035ae2db2367b425 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G2215-0409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G15-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G15-04054 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-18 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-44 |
filingDate |
2010-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4797968a92c4c0fe75297eaddb12f53e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa78a77243a401586585ad7a7866b8f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfef568377280a521862593e628b1e24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_617920ae56a83aca8f65fd51dd9a95e5 |
publicationDate |
2011-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2011024788-A1 |
titleOfInvention |
Semiconductor composite apparatus, led, led printhead, and image forming apparatus |
abstract |
A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the planarizing layer remote from the substrate. The semiconductor thin film formed on the planarizing layer. The second surface has a roughness of not more than 5 nm. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013043844-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011090689-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513697-B2 |
priorityDate |
2005-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |