Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32c182780ae8fd1eabf081eb5ef98479 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c46d81ab984795467b04f02b0e46d48e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1889 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 |
filingDate |
2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75cc9684fafaa00e06051d4a21eb27ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02fac37e00008e7b162f44de4ea0b1d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eac1a24c27d00b8308cbaa85cc3f16a |
publicationDate |
2011-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2011005936-A1 |
titleOfInvention |
Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method |
abstract |
There is provided a material for forming electroless plate which shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. n A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a water-insoluble polyester resin, and surface of the catalyst adhering layer should show a contact angle of 60° or smaller to purified water. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014272571-A1 |
priorityDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |