| abstract |
Disclosed herein is a fine and thick wiring drawn at high speed in such a manner that a region on the substrate, on which region the liquid droplet is scheduled to impact, is heated beforehand, and that immediately after the impact of the liquid droplet on the substrate, the liquid droplet is promptly solidified so as thereby to suppress the spread of the liquid droplet due to the wettability of the liquid droplet to the substrate, and also to suppress the clogging of the nozzle due to the heating of the substrate. Thereby, even in the case where a liquid droplet having a larger volume than before is used, high-speed drawing of a thick and fine wiring having a line width approximately equal to the liquid droplet size is realized independently of the substrate material. |