http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010296965-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-02
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filingDate 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_871648c9abb1105f6acc202076b1c334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71f6861adeb9d41ee17ba32096235f91
publicationDate 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010296965-A1
titleOfInvention Alloy solder and alloy solder manufacturing method
abstract The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder satisfactory in bonding reliability. n An alloy solder is manufactured by adding a predetermined amount of carbon to a Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C. An alloy solder manufacturing method includes a melting process for melting a Pb-free solder by heating the Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C., a carburizing process for carburizing the molten Pb-free solder held in the high-temperature atmosphere by adding a predetermined amount of carbon to the molten Pb-free solder, a stirring process for stirring a mixture of the molten Pb-free solder and carbon, and a cooling process for cooling the mixture of the Pb-free solder and carbon stirred by the stirring process and poured into a mold to solidify the mixture.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11396910-B2
priorityDate 2007-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.