| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5397
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-07 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46 |
| filingDate |
2009-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5da7ff1cdd095ac1ec3f9709fa3119e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6ef42ee96104edf06aec416b72a82d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e048914d24c5fa63f4614d1f759456d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c4707575532aed6709bb288565bb423 |
| publicationDate |
2010-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010280143-A1 |
| titleOfInvention |
Sealant composition |
| abstract |
A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator. |
| priorityDate |
2009-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |