| abstract |
An encapsulant adapted for use in a photovoltaic module includes a random terpolymer and a random copolymer. In one embodiment, the terpolymer includes ethylene, methyl acrylate, and glycidyl methacrylate, and the copolymer is a heat resistant copolymer. The encapsulant may include a carrier resin and/or one or more additives, such as a UV absorbing material, a hindered amine light stabilizer, a phosphite antioxidant, and/or a silane. |