| abstract |
Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate ( 101 ) and a second circuit substrate ( 102 ) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate ( 101 ) and the peripheral portion of the second circuit substrate ( 102 ) are connected to each other by connection members ( 10 a to 10 d ) having a wiring member ( 103 ) and a thermal hardening anisotropic conductive sheet ( 107 ), thereby performing electric connection. |