| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-28 |
| filingDate |
2008-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e90f398d46472aaac34fa99b23de550
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0cfd209445f3391c55a73e8f269fee3 |
| publicationDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010209699-A1 |
| titleOfInvention |
Electroconductive pressure-sensitive adhesive tape |
| abstract |
An electroconductive pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and having a thickness of 10 to 30 μm. The pressure-sensitive adhesive contains a spherical and/or spiking electroconductive filler in a content of 14 to 45 parts by weight per 100 parts by weight of the total solids contents of the pressure-sensitive adhesive other than fillers, the electroconductive filler has an aspect ratio of 1.0 to 1.5 and occupies 90 percent by weight or more of the total weight of fillers in the pressure-sensitive adhesive. The electroconductive filler has such particle diameters d 50 and d 85 , and the pressure-sensitive adhesive layer has such a thickness as to satisfy the following condition: d 85 >(the thickness of the pressure-sensitive adhesive layer)>d 50 . Even when the pressure-sensitive adhesive layer is slimmed, the electroconductive pressure-sensitive adhesive tape excels in adhesiveness and electroconductivity and has such superior bump-absorptivity as not to suffer from “lifting” from an adherend even when applied to a bumped portion of the adherend. The tape is therefore useful typically for the production of electrical/electronic appliances. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10329457-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9982170-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2871220-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013260171-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012202053-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9238760-B2 |
| priorityDate |
2007-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |