| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a02fcc64a0b4f0a5944cab8b3c0a5290
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_45e28e428d8385325812ac463fe66324 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 |
| filingDate |
2008-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2577e8611d188aedb603fa51a41e6cef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1510bc3982db29dd2f1f11bf6200a67f |
| publicationDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010206739-A1 |
| titleOfInvention |
Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
| abstract |
The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011089040-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102732920-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020240030-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016020812-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010024930-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102732920-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9567684-B2 |
| priorityDate |
2007-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |