| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17c8f765ced0e04a402ce8f8a752b3aa |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F3-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-642 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e7970638d94dde3885fa346e4a5b942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18a3fcca1e7bb3eeeb1c0b816a2be66c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5ebcc46954054acbb5d092eacade729
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a082466a2fed6713ba6b7666fe30333 |
| publicationDate |
2010-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010187560-A1 |
| titleOfInvention |
Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode |
| abstract |
A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009039502-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9640745-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8242595-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102061565-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015340581-A1 |
| priorityDate |
2006-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |