abstract |
A new epoxy resin represented by following general formula comprising, possessing one or more than one primary hydroxyl group and one or more than one epoxy group in one molecular, and said epoxy resin is useful for photo curing method. n n n n n n n n n n wherein n E: epoxy resin residue n c: 1, 2, 3 n d: 1, 2,3 n c+d=4 |