| abstract |
The present invention relates to a method for depositing a substance on a support, comprising the provision of a substance solution, the provision of a transfer solution capable of activating the support, the deposition of the transfer solution on a predefined position of the support and the deposition of the substance solution on the same predefined position where the transfer solution was placed, whereby an immobilization of the deposited substance at the location of overlap between the deposited transfer solution and the deposited substance solution on said support is achieved. n The present invention further relates to the use of a method for depositing a substance on a support for the manufacturing of a chip, a method for manufacturing a chip, wherein a substance is deposited on a chip substrate according to the method for depositing a substance on a support and a chip manufactured according to said method. |