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publicationDate 2010-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010129648-A1
titleOfInvention Electronic packaging and heat sink bonding enhancements, methods of production and uses thereof
abstract Electronic components described herein include a heat generating component surface; a heat sink having a top surface and a bottom surface; and a thermal interface material comprising a phase change material, wherein the heat generating component surface is coupled to the bottom surface of the heat sink by the thermal interface material. Methods of forming an electronic component include: a) providing a heat-generating component surface; b) providing at least one thermal interface material; c) providing a heat sink component having a top surface and a bottom surface; d) depositing the at least one thermal interface material onto at least part of at least one of the surfaces of the heat sink component, and e) coupling the surface of the heat sink component with the thermal interface material layer with the heat generating component surface to produce the electronic component.
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