http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010112360-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d68e1cf56cea6309519a1a10373982d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4275 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate | 2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ef38d80556a3e106ba17a747413d75b |
| publicationDate | 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2010112360-A1 |
| titleOfInvention | Layered thermal interface systems methods of production and uses thereof |
| abstract | A layered thermal interface system is described herein that comprises: at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader. Another layered thermal interface system is described herein that comprises: a silicon layer, at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader Methods of forming contemplated layered thermal system comprise: a) providing at least one deposition layer of metal, b) providing at least one plated layer of metal, c) providing at least one thermal interface material, and d) layering the at least one deposition layer of metal, the at least one thermal interface material, and the at least one plated layer of metal to produce the layered thermal system. Methods of forming another contemplated layered thermal system comprise: a) providing a silicon die, layer or surface, b) providing at least one deposition layer of metal, c) providing at least one plated layer of metal, d) providing at least one thermal interface material, e) providing at least one heat spreader material, and f) layering the silicon surface, the at least one deposition layer of metal, the at least one thermal interface material, the at least one plated layer of metal and the at least one heat spreader to produce the layered thermal system. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020357764-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114919252-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10980152-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9715904-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11682605-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11791237-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104218010-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012063103-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9282681-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8498127-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11670569-B2 |
| priorityDate | 2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.