patent/US-2010109160-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010109160-A1

Outgoing Links

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filingDate	2009-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92cae0edc591e6f06aa3f7c461046c82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ba6c71feb85356a87afe60cbc6ce370
publicationDate	2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2010109160-A1
titleOfInvention	Semiconductor device and method of manufacturing the same
abstract	A method of manufacturing a semiconductor device, includes the steps of preparing a semiconductor wafer having a connection pad, forming an insulating dam layer in which an opening portion is provided in an area including the connection pad, on the semiconductor wafer, and forming a bump electrode by mounting a conductive ball on the connection pad in the opening portion of the insulating dam layer.
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priorityDate	2008-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 64.