| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e75e3ac39ab15343a40b35be7c7bdab1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
| filingDate |
2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dfc77aeda0e8ab39c018a103a25e4d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e90558ffa1273d84b158162e14b3935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77ebe669f19dd8bcacd317ab0b352a59 |
| publicationDate |
2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010108528-A1 |
| titleOfInvention |
Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method |
| abstract |
A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103095866-A |
| priorityDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |