| abstract |
An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [η 0 ] thereof is in a range of from 1×10 2 to 1×10 6 mPa·sec, and satisfies the following equation (1): n 1<[η 1 ]/[η 0 ]≦3 (1) n where in the equation (1), [η 0 ] represents the minimum melt viscosity of the anisotropic conductive material, and [η 1 ] represents a melt viscosity at a temperature T 1 which is 30° C. lower than a temperature T 0 at which the minimum melt viscosity is exhibited. |