| abstract |
A package includes a conductive base plate; a ceramic wall configured to house a semiconductor device and a circuit board disposed adjoining of the semiconductor device, the ceramic wall configured to be disposed on the conductive base plate, the ceramic wall configured to include a frame shape having a screw hole in four corners; a metal seal ring configured to include a framed shape and be disposed on the ceramic wall; and a ceramic cap configured to be disposed on the metal seal ring, and the ceramic wall is screwed to the conductive base plate through the screw hole, and the package can radiate heat satisfactory in the heat generation from the semiconductor device, and can improve reliability, and can be applied to the high frequency of the microwave/millimeter wave/sub-millimeter wave band. |