| abstract |
The present invention provides a silicone resin composition for an optical semiconductor device, comprising n (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), n (CH 3 ) a Si(OR 1 ) b (OH) c O (4-a-b-c)/2 (1) wherein R 1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c<2,n n(B) 3 to 200 parts by mass of a white pigment,n n(C) 400 to 1000 parts by mass of an inorganic filler other than said white pigment,n n(D) 0.01 to 10 parts by mass of a condensation catalyst, andn n(E) 2 to 50 parts by mass of an organopolysiloxane comprising a linear diorganopolysiloxane moiety represented by the following formula (2),n n n n n n n n n n n n n wherein R 2 and R 3 are, independently of each other, a group selected from the group consisting of a hydroxyl group, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group and an allyl group, and wherein m is an integer of from 5 to 50. |