| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_63c6ea74d2349c06b052b764053a5ff9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fde38d1b9ee354937d9a62132aeffa9f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3ad91301d9936a077032f1314c1d3b54 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C37-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C37-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21D15-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21C37-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 |
| filingDate |
2006-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b9b23e48f3fb8bbc6fbcf0268792aa9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_235107288808c25987170ef3b42cef4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_430ed3aed95cfa319af9a189ece90b91 |
| publicationDate |
2010-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010066273-A1 |
| titleOfInvention |
Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting, acceleration cavity produced from the composite piping material |
| abstract |
In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114178794-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324134-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9241398-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016167169-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011130294-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113373404-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104525615-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015197080-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113385895-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11464102-B2 |
| priorityDate |
2005-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |