| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5e5e4671b3ba1fd59502c47747a80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cef1f43aa7ea51e6a592082d9f2a3103 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0735 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02 |
| filingDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4de9357a4ae8c048055422ea7ccd483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d69b22eabc4b0765b4be545899730c41 |
| publicationDate |
2010-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010062224-A1 |
| titleOfInvention |
Method for manufacturing a micromachined device |
| abstract |
The present invention provides a method for manufacturing micromachined devices on a substrate ( 10 ) comprising electrical circuitry, the micromachined devices comprising at least one micromachined structure, without affecting the underlying electrical circuitry. The method comprises providing a protection layer ( 15 ) on the substrate ( 10 ); providing on the protection layer ( 15 ) a plurality of patterned layers for forming the at least one micromachined structure, the plurality of patterned layers comprising at least one sacrificial layer ( 18 ); and thereafter removing at least a portion of the sacrificial layer ( 18 ) to release the at least one micromachined structure. The method furthermore comprises, before providing the protection layer ( 15 ), annealing the substrate ( 10 ) at a temperature higher than a highest temperature used during manufacturing of the micromachined device, annealing being for preventing gas formation underneath the protection layer ( 15 ) during subsequent manufacturing steps. The present invention also provides a micromachined device obtained by the method according to embodiments of the present invention. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9824882-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013001550-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699623-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016340778-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013043597-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9945030-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9123722-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758373-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11139211-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8647977-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014151902-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010032812-A1 |
| priorityDate |
2006-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |