Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S134-902 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
filingDate |
2009-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_485cdfad32ba3657fc6a6288eb041814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04638492b38d5ec539bb8ee941dc6e8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_394ee5f052e049c64fa1cadbd032e3a8 |
publicationDate |
2010-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2010059180-A1 |
titleOfInvention |
Method of manufacturing semiconductor device and cleaning apparatus |
abstract |
The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7988876-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008188084-A1 |
priorityDate |
2006-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |