http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010045320-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06744 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0675 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07307 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00 |
filingDate | 2009-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_829c1ca6e188e18290eb424f0de1d17f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34a7eb8a017770585ad5010793ef9b66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93de0cf2e159b965cb2a7987c041137f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1f4e79cf6a42d41d1f53bf848dcaf1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8100b97eafd935cf4074d8613b5b1c42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8f6647828866d4a0d7e4eaf478ff917 |
publicationDate | 2010-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2010045320-A1 |
titleOfInvention | High density integrated circuit apparatus, test probe and methods of use thereof |
abstract | The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010045317-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10120020-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009315579-A1 |
priorityDate | 1992-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.