| abstract |
The invention relates to a composite material, a high-frequency circuit substrate made from the composite material and a making method of the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a more than 60 percent of vinyl containing Butadiene styrene copolymer resin with molecular weight less than 11,000, a more than 60 percent of vinyl containing polybutadiene resin with polarity groups, and a maleic anhydride grafted polybutadiene styrene copolymer with molecular weight more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material of the prevent invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate. |