patent/US-2009301771-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009301771-A1

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filingDate	2009-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f6b06557bd72e7ddfc9da7efcb2139c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d43ca423cb1772a779cf00d5c025fc98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1ddf4b16c1fdc0404c62c9e23099516
publicationDate	2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2009301771-A1
titleOfInvention	Conductive bump, method for forming the same, and electronic component mounting structure using the same
abstract	A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
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priorityDate	2008-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727

Total number of triples: 94.