| abstract |
The present invention discloses a thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride oligomers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries. The composite provided in the present invention can form homogeneous solution in the low boiling point solvents, and the manufactured CCL has high vitrification transition temperature, excellent dielectric properties, low coefficient of expansion, low water absorption rate, high resistance to heat impact and excellent thermal conductivity and other properties. |