| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26a094fa020617014f7cc29c2d691426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0319bdd676e9175ad14db747feed94d3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C27-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C3-16 |
| filingDate |
2008-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd5d686f8900f134f68f8f6c954bc37d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_894107683deaf59fea1600552235ea59 |
| publicationDate |
2009-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009291822-A1 |
| titleOfInvention |
Lead-free sealing material |
| abstract |
A lead-free sealing material is provided, which contains a glass with a composition including 47.5-67.5 mole % SnO, 2.5-15 mole % MgO, and 30-40 mole % P 2 O 5 . The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8261618-B2 |
| priorityDate |
2008-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |