| abstract |
A curable resin material composition includes an addition-polymerization-curable silicone resin material that gives a silicone resin having a glass transition temperature of 50° C. or less when cured, the addition-polymerization-curable silicone resin material including, a SiH-group-containing siloxane-based compound containing a SiH group where a silicon atom is bonded to a hydrogen atom, a C═C-bond-containing siloxane-based compound containing a carbon-carbon double bond capable of effecting addition reaction with the SiH group, and a hydrosilylation addition reaction catalyst; and a non-reactive siloxane-based compound that does not react with the SiH-group-containing siloxane-based compound or the C═C-bond-containing siloxane-based compound, that is compatible with the addition-polymerization-curable silicone resin material, and that has a pour point of 0° C. or less. |