| abstract |
An inkjet apparatus is disclosed. The inkjet apparatus for printing a solder resist can include: a first reservoir storing a monomer composition, a second reservoir storing a hardening agent composition, and an inkjet head, which can be connected to the first reservoir and the second reservoir to eject the monomer composition and the hardening agent composition. By utilizing an inkjet apparatus according to certain embodiments of the invention as set forth above, the occurrence of blockage in the nozzles caused by ink solidified inside the inkjet head and reservoir can be prevented. Also, the problem of spreading of the ink during printing can be resolved, and the thermal resistance, chemical resistance, and abrasion resistance of the solder resist after inkjet printing can be improved. |