| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-00 |
| filingDate |
2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bb0ada1ef8caa79f31532ddc5a53c49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cb10ef15ec0cdb35afdcc7231aa7c6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a9f7c56a802bdd3255843161b1ad29c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7c0a1ee3bc6758251c194ff0d7acba2 |
| publicationDate |
2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009266788-A1 |
| titleOfInvention |
Method for fabricating conductive pattern on flexible substrate and protective ink used therein |
| abstract |
The invention discloses a method for fabricating a conductive pattern on a flexible substrate. A flexible substrate having a conductive layer thereon is provided. A protective ink is screen printed on the conductive layer, wherein a portion of the conductive layer is exposed through the protective ink. The exposed portion of the conductive layer is removed by etching using the protective ink as a mask. The protective ink is then removed, thus providing a conductive pattern with a minimum line width of not greater than 150 μm. The invention also discloses a composition for the protective ink. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2992141-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016203268-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015040392-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9820388-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018168032-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105611725-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016302310-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9648752-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8628679-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2539508-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011174771-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9572265-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105813394-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013186241-A1 |
| priorityDate |
2008-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |