| abstract |
An electronic component mounted structure is constituted by connecting together via a conductive adhesive 2 the electrode terminals 1 a of a first electronic component such as a semiconductor element 1 and the electrode terminals 6 a (here, projecting electrodes formed thereon) of a second electronic component such as a circuit substrate 6 , and filling a molding resin 4 into a gap between the semiconductor element 1 and the circuit substrate 6 . The molding resin 4 is composed of a low elasticity layer 3 and a high elasticity layer having higher elasticity than the low elasticity layer, and the low elasticity layer 3 lies adjacent to the whole of the outer surface of the conductive adhesive 2. |