| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5186fe7b15854b8bf7c30787e96fb141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_671c0be118594d8173cb118a1db4ebfe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_087f0898aae464f3a8b4bc0af9be3af7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_befa5c3d22c25d2bd2fb5924dca8edb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f01a0f3e636de883a2933f91cc137fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54d39702e197769ff9356df91e0ef6a6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02319
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5228 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-482
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94a97e0fec5a2d20d344e96124a38d80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccfa3451d0f6b028c6c623c97d91c82a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ade5215bf57ab7d55d695ebe5fbd1249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8462a8bb117073b6dee27375a5d07f9b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ae75d349db24cf8496454f9c8e44990
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c9369c0b53ac16a7a7e3006cca04f4e |
| publicationDate |
2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009243081-A1 |
| titleOfInvention |
System and method of forming a wafer scale package |
| abstract |
A system and method for forming a wafer level package (WLP) (i.e., wafer level chip size package) is disclosed. The WLP includes a silicon integrated circuit (IC) substrate having a plurality of die pads formed on a top surface thereof and a plurality of polymer laminates positioned thereon. Each of the polymer laminates is comprised of a separate pre-formed laminate sheet and has a plurality of vias formed therein that correspond to a respective die pad. A plurality of metal interconnects are formed on each of the plurality of polymer laminates so as to cover a portion of a top surface of a polymer laminate and extend down through the via and into contact with a metal interconnect on a neighboring polymer laminate positioned below. An input/output (I/O) system interconnect is positioned on a top surface of the wafer level package and is attached to the plurality of metal interconnects. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016118272-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019206786-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010078797-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9484318-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9368460-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9230902-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10276486-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8829676-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014339696-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11133274-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10700025-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9553000-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8114708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013001776-A1 |
| priorityDate |
2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |