| abstract |
The invention relates to a solid electrolytic capacitor, obtained by bonding a capacitor element to a lead frame, especially a lead frame having a partial plating of low-melting point metal which is provided by applying taping on some part of the lead frame. The solid electrolytic capacitor of the invention is excellent in heat resistance and has high degree of completion of resin encapsulation, which contributes to its excellent moisture resistance. Also, since a lead frame with low-melting point metal plating can be used, no further plating process is required and in case of using resistance welding method, a solid electrolytic capacitor can be obtained easily through anodic bonding in stacking elements. |