| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87397b1c545320b1b14355cf879ce66d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66966793244001154113fab054c5b358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d7f30d88f767876c8b790ef25dc1ad35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_013d3194bd86e338e8918ae29ab2d2ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4892982dfc9df6eab2bc1cfcccc070eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8c6ba1da9045d06194578537c9cacf33 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-176
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
2007-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c75bc23b3fc3a5322f07ea87ed45f07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8285c52ab2acb958d33c7a1c2dfb598c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c48777b7e2c906df3ebd32a03b973a45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_150a6621222cfbba92c650e16cafde70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22a2b539d5a67ab0dd15e8e8d98c7179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1955d450c6d82bdb37f15efa8ab14eab |
| publicationDate |
2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009236036-A1 |
| titleOfInvention |
Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |
| abstract |
A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011077328-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013128435-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10144799-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8828806-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010304536-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8847415-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016200860-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2258757-A1 |
| priorityDate |
2006-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |