http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009233447-A1

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publicationDate 2009-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2009233447-A1
titleOfInvention Control wafer reclamation process
abstract A method of recycling a control wafer having a dielectric layer deposited thereon involves removing most of the dielectric layer by plasma etching leaving a residual film of the dielectric and then removing the residual dielectric film by a wet etching process. The combination of the dry and wet etching provides effective removal of the dielectric material without damaging the wafer substrate and any residual wet etching byproduct particulate remaining on the wafer substrate is then removed by APM cleaning and scrubbing.
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