| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b249f0d6a90920b59f088e673331ce6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9a4af3a35b4b5779adb7a8cb30efaef |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29198
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2008-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fb115f110e83617db02f429aaa1cdef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b901943f7e46307ec3869d62a8a09dc |
| publicationDate |
2009-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009218703-A1 |
| titleOfInvention |
Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape |
| abstract |
A lamination tape is disclosed which includes a base film with an adhesive layer on one side wherein the coefficient of thermal expansion (CTE) of the adhesive layer is adapted so as to reduce warpage of a semiconductor die when the lamination tape is attached to the passive side of the semiconductor die. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101670523-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11728256-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022328392-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11393746-B2 |
| priorityDate |
2008-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |