Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1621e69ccea431089e5d498b3be80b89 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00ec2a22a879ef0870bd0bf38b692522 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461 |
filingDate |
2008-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91944c9cdb0b1bb618e9e72b0af015ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_384839b586fd53af66811fd351c72517 |
publicationDate |
2009-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2009215266-A1 |
titleOfInvention |
Polishing Copper-Containing patterned wafers |
abstract |
An aspect of the invention provides a method for polishing a patterned semiconductor wafer containing a copper interconnect metal with a polishing pad. The method includes the following: a) providing an aqueous polishing solution, the polishing solution containing an benzotriazole (BTA) inhibitor and a copper complexing compound and water; b) polishing the patterned wafer with the aqueous polishing solution and the polishing pad in a manner that dissolves copper into Cu +1 ions, the Cu +1 ions and BTA inhibitor having a concentration where [BTA]*[Cu +1 ]> than Ksp for Cu-BTA precipitate if the aqueous solution did not contain the complexing compound; and c) oxidizing at least some of the copper ions to prevent the polishing from precipitating the Cu-BTA precipitate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8440097-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8435896-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102121127-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022093688-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10344187-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014030897-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104131289-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114561187-A |
priorityDate |
2008-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |