http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009202333-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
filingDate | 2005-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3fca4bf28f3c9eadadc67b2c8e60ef8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a41e0d3571a157b254537cad3683b2f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a88c0a76a014aee72a8744cddbfb76b |
publicationDate | 2009-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2009202333-A1 |
titleOfInvention | Electronic component pickup method, electronic component mounting method and electronic component mounting apparatus |
abstract | This invention intends to provide an electronic component pick-up method, an electronic component loading method and an electronic component loading apparatus which are n capable of executing a pick-up operation of an electronic component adhesively held on a carrier stably and with high productivity. n In an electronic component pick-up method for picking up a chip 6 adhesively held by an adhesive layer 5 a on a sheet 5, as the adhesive layer 5 a, an adhesive containing a compound generating a nitrogen gas by application of ultraviolet rays is employed. In the pick-up operation, with a light applying unit 8 being located beneath the chip 6 to be picked up, ultraviolet rays is applied to the adhesive layer 5 a located on the rear side of the chip 6 from the lower side of the sheet 5, and the chip 6 is picked up by bringing the holding tool 20 into contact with the upper surface of the chip 6 in a state where the nitrogen gas generated from the adhesive layer 5 a has created a gaseous layer G between a bonding boundary between the rear surface of the chip 6 and the adhesive layer 5 a. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10497589-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8167523-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011235299-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009016868-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8544165-B2 |
priorityDate | 2004-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 203.