| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9f5e5fbeb96815ced125cefd007c3e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fae15ff9fd57ea173decb089e7a32e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M2205-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M3-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2009-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f8691fcfeb8a8ed460cee68ea75a21a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c12c32ef95c4df78984040f2f70e6c0 |
| publicationDate |
2009-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009181218-A1 |
| titleOfInvention |
Conductive pattern and method of forming thereof |
| abstract |
The present invention relates to a conductive pattern and a method for forming the conductive pattern, and more particularly, to a method for forming a conductive pattern, which comprises the steps of 1) preparing a substrate; 2) forming a first pattern by printing a first composition that includes an adhesion promoter and a solvent on the substrate; 3) forming a second pattern by printing a second composition that includes a conductive particle and a solvent on the first pattern; and 4) sintering the first pattern and the second pattern. The method for forming the conductive pattern according to the present invention may improve an adhesion property between a pattern and a substrate and may form a fine pattern having high resolution without formation of bank on a hydrophobic substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9386708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014141156-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11472978-B2 |
| priorityDate |
2008-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |