| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
2008-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e495832ec5b2860001843d1b245143f |
| publicationDate |
2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009176324-A1 |
| titleOfInvention |
Method for encapsulating a substrate and method for fabricating a light emitting diode device |
| abstract |
The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top side of the substrate; n (b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer; n (c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions; n (d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions; n (e1) molding the top side of the substrate with a molding material; n (f1) curing the molding material; and n (g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8993358-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9293653-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9433974-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013210179-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8900892-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I608522-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10910510-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I581457-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10269781-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016111588-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014150263-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10685946-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012305956-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10319705-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019079046-A1 |
| priorityDate |
2008-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |