| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_729434b6675da93073e9a3808da6d403 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12396
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate |
2009-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2119581671f67b5f44ed8a95725a31e5 |
| publicationDate |
2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009176120-A1 |
| titleOfInvention |
Highly electrically conductive surfaces for electrochemical applications |
| abstract |
A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9734852-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8885299-B1 |
| priorityDate |
2008-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |