| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10113 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22 |
| filingDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d801ec1b86ce839e687cbc9894ca18b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b284dd48cf8d6c48f1fa1b2d3e65cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f889512717eac7f3b1b1516d45510f7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfdf6496268a262f7600dcda15143b4e |
| publicationDate |
2009-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009159565-A1 |
| titleOfInvention |
Method to Pattern Metallized Substrates Using a High Intensity Light Source |
| abstract |
A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014029737-A1 |
| priorityDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |