| abstract |
A conductive pattern formation ink capable of forming a conductive pattern having high reliability, a conductive pattern having high reliability, a method of forming a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink from a liquid droplet ejection head on a surface of a ceramic molded body made of a material containing ceramic particles and a binder, the liquid droplet ejection head having ejection portions for ejecting the ink in the form of liquid droplets and an ejection surface on which the ejection portions open. The ink contains a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a surface tension adjuster that is contained in the water-based dispersion medium and adjusts surface tension of the ink, wherein in the ink whose surface tension is adjusted by the surface tension adjuster, a contact angle of the ink with respect to the ejection surface of the liquid droplet ejection head at 25° C. is in the range of 50 to 90°, and a contact angle of the ink with respect to the surface of the ceramic molded body at 25° C. is in the range of 45 to 85°. |