| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12bc6809ac0dce824e2152ed55806869 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61M25-0043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2017-22002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61M2025-0057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2017-22082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49798
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61M37-0092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B17-2202 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61M25-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B17-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61M37-00 |
| filingDate |
2009-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6bd9bed788af794c2a59344fdf979e7 |
| publicationDate |
2009-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009144955-A1 |
| titleOfInvention |
Ultrasound radiating members for catheter |
| abstract |
A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into the slab. The method further comprises making a plurality of cuts through the top surface and into the slab. The cuts form a plurality of polygons that are generally centered about one of the holes. The method further comprises plating the slab with an electrically conductive material. The method further comprises removing the electrically conductive material from the top surface of the slab. The method further comprises cutting the slab substantially parallel to the top surface. |
| priorityDate |
2002-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |