patent/US-2009134205-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009134205-A1

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-08
filingDate	2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aceb48a5f1019948400a7c42a45df802
publicationDate	2009-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2009134205-A1
titleOfInvention	Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus
abstract	A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding portion, placing a weight on the electronic component, and heating and melting the solder while pressing the electronic component toward the circuit board with the weight. The weight is spaced from the electronic component while the temperature of the solder is still high after the melted solder wets the bonding portion and the bonding surface of the electronic component and spreads out therebetween.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015034367-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009184155-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9296056-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8777091-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9254531-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9480144-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013256387-A1
priorityDate	2005-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 67.