| abstract |
The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, using an electroless plating method of forming a metal plating layer on the surface of a base material made of resin powder in an electroless plating solution, wherein an ultrasonic treatment is performed at the time of forming the plating layer. The present invention has advantages in that an aggregation phenomenon, which is generated when the base material made of the resin powder is plated using an electroless plating method, does not occur and a plating reaction can be performed at low temperature, so that it is possible to obtain a compact plating layer and plating powder having improved uniformity and adherence with respect to resin powder. Further, the present invention, unlike the conventional technique, has advantages in that post-treatment processes are not performed and a plating reaction is performed at low temperature, so that the process operating cost is reduced and the processes are made simple. |