| abstract |
The package ( 100 ) of the invention comprises at least one semiconductor device ( 30 ) provided with bond pads ( 32 ); an encapsulation ( 40 ), an interconnect element ( 20 ) and a heatsink ( 90 ). This element comprises a system of electrical interconnects ( 12 ) and is at least substantially covered by a thermally conductive, electrically insulating layer ( 11 ) at a first side ( 1 ) and that is provided with an electric isolation ( 13 ) at a second side ( 2 ), such that the isolation ( 13 ) and the thermally conducting layer ( 11 ) electrically isolate the electrical interconnects ( 12 ) from each other. At least one component of the encapsulation ( 40 ) and the heatsink ( 90 ) has an interface with the interconnect element ( 20 ), which interlace extends over substantially the complete side ( 1,2 ) to which the said component ( 40,90 ) is attached. |