| abstract |
A sheet-like underfill material includes a base and adhesive layer provided peelably on the base for use in a flip chip mounting process in the manufacture of a semiconductor device. The process includes laminating a sheet-like underfill material onto a circuit face of a semiconductor wafer having bumps on its circuit face and, simultaneously, allowing the bumps to pierce the adhesive layer and allowing the tops of the bumps to penetrate the base. The base has a storage elastic modulus of 1.0×10 6 Pa to 4.0×10 9 Pa, a breaking stress of 1.0×10 5 Pa to 2.0×10 8 Pa, and a Young's modulus of 1.0×10 7 Pa to 1.1×10 10 Pa. The adhesive layer has a storage elastic modulus of 1.0×10 4 Pa to 1.0×10 7 Pa and a breaking stress of 1.0×10 3 Pa to 3.0×10 7 Pa. |